@inproceedings{Unger2014,
title = {{Modeling the Ultrasonic Softening Effect for Robust Copper Wire Bonding}},
booktitle = {Proc. of the Int. Conf. on Integrated Power Electronics Systems},
pages = {25--27},
year = {2014},
author = {A. Unger and W. Sextro and S. Althoff and T. Meyer and K. Neumann and F. R. Reinhart and M. Br\"okelmann and D. Bolowski and K. Guth}
}